Optosurf Wafermaster WM-300
晶圓全表面掃瞄

該測量系統應用於背面研磨後全面非接觸式光學掃瞄。

1.針對粗糙度,波紋度,翹曲.

2.快速全面掃瞄.

3.非接觸式

4.圖形展示易讀辨認.

5.抗震動,免防震台.

 

 

 


  • 獨特的特性

    After processing SI wafer are backside ground to reduce their thickness from 700μm to < 50μm. In the last grinding step, the surface quality needs to be close to polished to keep the underlying chip structures intact.

    OptoSurf has developed measurement devices based on scattered light technology that perform a fast, whole-surface scan of wafer surfaces, measuring time for a 300mm wafer is less than 30s with a resolution of Ra < 1nm

  • 12 inch wafer after grinding.

    full surface roughness measurement.